Larger image

Larger image

The MicroBatch II Automated Curing Oven System integrates a cluster of MicroBatch II systems within a small footprint and can be configured with variable quantities of chambers to match customized process profiles, throughput and low level work-in-progress (WIP) objectives. More importantly, the robotic and control systems ensure seamless integration into any production line with Computer Integrated Manufacturing (CIM).

The MicroBatch II Automated Oven Family supports continuous in-line curing and small lot sizes by handling magazines and custom designed baskets. One of the key technology features of the MicroBatch II is its unique upgradeability which grows with the needs of the customer, allowing cushion for budget and timing considerations. The modular design of the MicroBatch II product family starts with the smallest system consisting of a 1-chamber solution, which is expandable up to 24 chambers.

The modularity of MicroBatch II is also applicable when it comes to automation. Customers have the option of starting out with a small solution to meet current production requirements, upgrading with additional chambers via field upgrades as manufacturing volumes grow.

The MicroBatch II can be configured to match custom factory layouts and address specific operation needs such as linking up/downstream process tools, or serve as stand alone islands of automation. The loading and unloading of oven chambers can be fully automated to eliminate operator assistance and diminish human-error, whereas a semiautomatic operation can facilitate reduced operator requirements in assuring complete process cycles. Automation needs are field upgradeable.

Applications

• Die coat cure
• Die attach cure
• Encapsulation cure
• Underfill cure
• Post mold cure
• Ink mark cure
• Heat sink attach cure
• Automotive Diode Curing
• Optoelectronic and wireless component curing

Key Benefits

• PLC Control System with HMI
• Modular oven design allows for additional heating units to be added
• Increased throughput via reduced work-in-progress (WIP) inventory
• Vertical stacked design results in reduced floor space
• Superior thermal profile and improved product reliability with precise product temperature control and uniform temperature distribution within each chamber
• Flexible programming and independent curing capabilities within each chamber allows optimal utilization
• Active Cooling option reduces process time and cooling consistency
• Bar Coding/CIM integration allows automatic recipe download
• Each chamber provides identical output results, with consistent input variables